At Intel's big Innovation 2023 event, CEO Pat Gelsinger confirmed that the company would adopt a 3D Cache approach for CPUs in the future - though it won't be a part of the upcoming Meteor Lake ...

AMD has teased the launched of a new Ryzen processor with two chiplets, each of which will include a healthy dollop of 3D V-Cache.

Saying that it has been a busy launch season for AMD is an incredible understatement. Not only did we see the release of the high powered, high performing Ryzen 7000X Series, but we also got a full ...

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Something to look forward to: There have been a lot of revelations at Intel's Innovation 2023 event, including confirmation that the company will follow a similar path as AMD by using 3D-stacked cache ...

Forward-looking: 3D chip stacking technology has yet to arrive in a big way, with only Intel Foveros reaching the market in Lakefield CPUs, and some Zen3-with-vertically-stacked-cache products waiting ...

AMD unveiled multiple products and technologies out now, coming soon, and coming out in 2022 during its virtual Computex 2021 keynote. One of the highlights is the next-gen 3D V-Cache stack chiplet ...

AMD's Zen 2 and Zen 3 processor cores stack up pretty well against Intel's finest, largely thanks to the use of a secret weapon: massive last-level caches. The company's Radeon arm pulled the same ...

AMD EPYC Milan-X CPU will feature 3D die stacking through its 3D V-Cache technology, according to the most recent leak. Despite the successful release of the EPYC 7003-series, the card manufacturer is ...

AMD had a surprise at Computex: CPUs with a lot of L3 cache, and a claimed generational-equivalent performance uplift. Share on Facebook (opens in a new window) Share on X (opens in a new window) ...