Designers, who need to build high performance real-time sensing systems, are greatly challenged since every building block in the system needs to be built with a technology that allows that building ...
HSINCHU, Taiwan & SAN JOSE, Calif.--(BUSINESS WIRE)--United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, and Cadence Design Systems, Inc.
Intel's next-gen Xeon "Clearwater Forest" CPUs will feature up to 288 cores based on the new Darkmont CPU architecture, with no P-Cores in sight with Clearwater Forest, its 288 E-Cores. The latest ...
TAIPEI, Taiwan--(BUSINESS WIRE)--TrendForce reports that the focus on HBM products in the DRAM industry is increasingly turning attention toward advanced packaging technologies like hybrid bonding.
Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...
Hybrid, 3D integrated optical transceiver. (A,B) The test setup: the photonic chip (PIC) is placed on a circuit board (green), and the electronic chip (EIC) is bonded on top of the photonic chip. (C) ...
Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...
Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...
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