WEST LAFAYETTE, Ind. – New findings have solved a longstanding obstacle in research to understand the effects of heat conduction in solid materials, a critical issue in many applications, from energy ...

Master Bond EP54TC—is engineered for critical thermal management applications, featuring the highest thermal conductivity.

Engineering Precision Drives SiSiC Adoption The global heat exchanger and thermal management industry is undergoing a ...

Rogers Corporation has introduced RT/duroid(tm) 6035HTC, a new high-thermal-conductivity (HTC) laminate material engineered for low loss in high-power circuits. Rogers Corporation has introduced ...

Prof. Gal Shmuel of the Faculty of Mechanical Engineering at the Technion—Israel Institute of Technology has developed an ...

UCLA researchers identify a metal with ~3× the heat conduction of copper, offering a potential leap in cooling for chips, AI accelerators, and next-gen electronic systems.

The power-semiconductor industry is experiencing growth exceeding 7% per year, driven by new applications such as electric cars and new technologies like silicon-carbide (SiC) and gallium-nitride ...

Researchers at the School of Engineering of the Hong Kong University of Science and Technology (HKUST) have developed a sustainable and controllable strategy to manipulate interfacial heat transfer, ...

Precision Ceramics, a division of McGeoch Technology, is a company dedicated to the engineering of technical ceramics. From procurement and supply through to technical design and specialist machining, ...

The thermoelectric effect can turn waste heat into electrical energy. To make use of it, special materials with unusual properties are required. A remarkable effect has now been demonstrated, which ...