Simple and inexpensive semiconductor devices in earlier generations of electronic systems were easily discarded or recycled when they were damaged either before or during the printed circuit board ...

Conversely,experienced embedded designers know to mask or tent BGA vias at thedesign and layout level. Even when this step is omitted, adesign-for-manufacture (DFM) check mapped out at the planning ...

In our previous article on Ball Grid Arrays (BGAs), we explored how to design circuit boards and how to route the signals coming out of a BGA package. But designing a board is one thing – soldering ...

This is somewhat Mac related, but I think it's more of a chip issue (esp on factory-assembled boards), so I figured I'd post here. Basically, I'm having repeated failures of an ATI 4850 graphics card ...

Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.

Memory module makers often use X-ray technology to inspect samples taken from a manufactured batch for abnormal soldering joints. BGA connections are not easily accessible from all sides and as a ...

(MENAFN- EIN Presswire) EINPresswire/ -- In the fast-paced electronics industry, the ability to produce compact, high-performance devices depends heavily on advanced PCB assembly techniques. FR4PCB, a ...