The incessant demand for more speed in chips requires forcing more energy through ever-smaller devices, increasing current density and threatening long-term chip reliability. While this problem is ...

However, with electrical gadgets and devices getting increasingly smaller and functionally more powerful, the current density flowing through the copper and gold conductors in these devices – which ...

Electromigration (EM) remains a critical reliability challenge in modern microelectronic systems, particularly as device miniaturisation and increased current densities intensify the phenomenon. In ...

While integrated circuit manufacturers have worried about electromigration for a long time, until recently most of their concerns have focused on the on-chip interconnects. The larger dimensions found ...

Figure 1: Fabrication and ampacity of CNT–Cu composite. We numerically estimated the ampacity of the CNT–Cu composite by assuming that the material ruptured by current-induced Joule heating, leading ...