Substrate suppliers are slashing capacity allocated to wirebond IC substrates. We hear about “limited tenting capacity,” “no support for EBS designs,” and requests for “conversion to etchback” designs ...

To exhibit two types of large FC‑BGA substrates for AI applications and innovative chip‑embedding technology To highlight RF‑SiP substrates that adopt a groundbreaking application of Cu‑Post ...

LG Innotek's supply of mobile semiconductor substrates is reportedly expanding. As rival corporations focus on producing high-value flip-chip (FC) ball grid array (BGA) substrates, where demand is ...

LG Innotek is seeking to enter Tesla's AI semiconductor supply chain by targeting ABF-based FC-BGA substrate orders for the automaker's... Glass substrates are entering a critical pre-mass production ...

Samsung Electro-Mechanics is reportedly pouring over 1 trillion won ($662.3 million) into capital expenditure for a second consecutive year, concentrating its investment on FC-BGA substrates, a ...

Toppan has addressed a challenge for heterogeneous integration of semiconductors by developing a high-reliability coreless organic interposer1 for next-generation semiconductors with a new product.

Samsung Electro-Mechanics (Semco) has announced the development of FC-BGA substrates for advanced driver assistance systems (ADAS), as well as the expansion of its high-end automotive semiconductor ...

LG Innotek to participate in ECTC for the first time in 2026, joining 135 leading global semiconductor companies To exhibit two types of large FC‑BGA substrates for AI applications and innovative chip ...

LG Innotek to participate in ECTC for the first time in 2026, joining 135 leading global semiconductor companies To exhibit two types of large FC‑BGA substrates for AI applications and innovative chip ...