Since the 1920s, sheet steel has been the most commonly utilized structural material in the automobile industry, with steel’s strength and stiffness making it ideally suited for durable chassis and ...

Failure analysis (FA) is an essential step for achieving sufficient yield in semiconductor manufacturing, but it’s struggling to keep pace with smaller dimensions, advanced packaging, and new power ...

Sheet steel has been the most commonly used structural material in the automobile industry since the 1920s. Steel is stiff and robust, making it an ideal option for durable chassis and welded parts.

When a chip malfunctions it’s the job of the failure analysis engineer to determine how it failed or significantly deviated from its key performance metrics. The cost of failure in the field can be ...

The first step for semiconductor chips is visual inspection using an optical microscope or electrical measurements. 2 Mechanical probing, electron beams, emission microscopy, liquid crystal, etc., are ...

HILLSBORO, Ore.--(BUSINESS WIRE)--Thermo Fisher Scientific, the world leader in serving science, has introduced the Thermo Scientific™ Meridian™ EX System— an electron-beam-based failure analysis ...

Limitations in the original Ln-Sec equation prompted development of a modified equation better suited thru the original equation for remaining life assessments. The modified Ln-Sec equation described ...

Many sources of yield loss, including out-of-spec equipment, incorrect handling of material, photomask defects, design-process sensitivities, library marginalities, and test issues, can occur during ...