MILPITAS, Calif. — LSI Logic Corp. today announced it has licensed its organic laminate flip-chip ball-grid array (FBGA) technology to Advanced Interconnect Technologies of Pleasanton, Calif., which ...

So, you’re trying to get a handle on BGA flip chip tech? It’s one of those things that sounds complicated, but once you break it down, it’s not so bad. Basically, it’s a way to connect chips to ...

MILPITAS, Calif. — LSI Logic Corp. today announced it has licensed its organic laminate flip-chip ball-grid array (FPBGA) packaging technology to Siliconware Precision Industries Ltd., a contract ...

You may have heard the phrase “flip-chip” before: it’s a broad term referring to several integrated circuit packaging methods, the common thread being that the semiconductor die is flipped upside down ...

"Moving to a flip-chip BGA package allows for better removal of heat (the active logic is closer to the heatsink), as well as enabling more IO pins/balls on the package itself," he said. However, Lal ...

Dr. Walter Brenner, Technical Director of Master Bond Inc., talks to AZoM about the future of flip chip packaging and advances in underfill formulation and processing. What does a typical flip chip ...

So, you’ve probably heard about flip chip IC technology, maybe in passing or maybe you’re knee-deep in a project that needs it. It’s this pretty neat way of putting computer chips onto circuit boards.