Wafer breakage is the most serious impact of killer crystalline defects. About 0.1 to 0.2% of silicon wafers break. The ...
Full-blown process excursions that affect every wafer are comparatively easy for fabs to detect and fix. However, “onesie-twosie,” lower-volume excursions can go unresolved for months or even years.
Understanding how dislocations (line defects in the crystal structure) occur when 3D-printing metals has been unclear to materials scientists. Understanding when and how dislocations form in ...
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