Several trends in IC packaging, including changes in sizes and construction, are combining to make the inspection of packaged chips more complicated, difficult, and time-consuming. IDMs (integrated ...

Several equipment makers are ramping up new inspection equipment to address the growing defect challenges in IC packaging. At one time, finding defects in packaging was relatively straightforward. But ...

Much has changed in IC packaging technology since the first real-time microfocus X-ray systems entered the inspection market nearly 20 years ago. The trend for high-density packaging is moving from ...

The technology to enable sampling and the need for more metrology and inspection data in a production setting have aligned just in time to address the semiconductor industry’s newest and most complex ...

PTI will showcase VeriPac Package Quality Inspection Systems during Interphex, April 21-23 at the Jacob Javits Center in New York City, Booth 2145B. CCIT of syringes, liquid filled & lyophilized vials ...