The FICS Research Institute (University of Florida) has published a new research paper titled “Secure Physical Design.” This is the first and most comprehensive research work done in this area that ...

Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

Historically IC package design has been a relatively simple task which allowed the die bumps to be fanned out on a package substrate to a floorplan geometry suitable for connecting to a printed ...

As the complexity of IC designs continues to grow, moving critical checks earlier in the design cycle helps designers identify and resolve issues before they escalate, streamlining the overall ...

The estimated revenue of Taiwan's IC design industry in 2022 totalled at a commanding US$40 billion. The sector has proven itself to be eminently high-yielding with an enviable average profit margin ...

Development of the complex ICs in these devices requires advanced design techniques and nanometer process geometries, standards that conventional design solutions are not equipped to handle. The ...

TSMC is advancing system-level innovation by improving the 3D IC design ecosystem through enhanced collaboration with foundries, customers, and partners, according to a recent blog post. The latest ...