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Imaging silicon defects using Raman and PL multivariate imaging

PCA and K-means clustering applied to Raman and PL imaging reveal structural defects in silicon wafers, enhancing understanding of optoelectronic performance.
Business Wire

Onto Innovation Debuts Sub-surface Defect Inspection for Advanced Packaging

Onto has received multiple orders in support of high bandwidth memory (HBM), advanced logic and a variety of specialty segments WILMINGTON, Mass.--(BUSINESS WIRE)--Onto Innovation Inc. (NYSE: ONTO) ...
Optics

imec makes silicon photonics laser ‘breakthrough’ on 300 mm wafers

imec, a Belgium-based research and innovation hub in nanoelectronics and digital technologies, has announced “a significant milestone in silicon photonics” with the successful demonstration of ...
Business Wire

OKI Develops Tiling crystal film bonding (CFB) Technology for Heterogeneous Integration of Optical Semiconductors onto 300 mm Silicon Wafers

TOKYO--(BUSINESS WIRE)--OKI (TOKYO: 6703) has successfully developed Tiling crystal film bonding (CFB; Note 1) technology using its proprietary CFB technology. This technology makes possible the ...
Electronic Design

Ultra-Thin Silicon Wafers Wring More from Power Electronics

Modern chips are manufactured on slabs of silicon less than a millimeter thick. But semiconductor companies try to slice these silicon wafers thinner and thinner to squeeze more performance out of ...
Semiconductor Engineering

2D Semiconductors Make Progress, But So Does Silicon

Semiconductor industry researchers have been anticipating the need for better transistor channel materials to replace silicon for a long time, but silicon devices have continued to improve enough to ...