Semiconductor Engineering

A Single-Layer Mechanical Debonding Adhesive For Advanced Wafer-Level Packaging

Better performance and lower cost are always key trends being pursued in the semiconductor industry. Moore’s law has provided a very well-defined relationship between performance and cost and the ...

Wafer Level Packaging Market Size to Exceed $26.79 Billion by 2035 | SNS Insider

The U.S. wafer level packaging market was estimated to be worth USD 4.02 billion in 2025 and is expected to grow at a compound annual growth rate (CAGR) of 9.98% between 2026 and 2035, reaching ...
Nasdaq

ACM Research Launches Its First Plating Tool to Support Wafer-Level Packaging and Plating Applications in Compound Semiconductor Manufacturing

FREMONT, Calif., Aug. 25, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...
Business Insider

ClassOne Technology Expands Solstice® Single-Wafer Portfolio with New 300mm Solstice Max Platform for Advanced Packaging Metallization

PHOENIX, Oct. 07, 2025 (GLOBE NEWSWIRE) -- SEMICON WEST -- ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today ...
Seeking Alpha

ACM Research Expands Advanced Packaging Portfolio with Introduction of Frame Wafer Cleaning Tool

FREMONT, Calif., May 08, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACMR) (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level ...
Nasdaq

ACM Research’s 18 Chamber, 300mm Ultra C VI Single-Wafer Cleaning Tool Enters Mass Production

ACM’s Ultra C VI Tool Supports Most Semiconductor Clean Processes for Advanced Logic, DRAM and 3D NAND Manufacturing; Provides 50% More Throughput Than 12 Chamber Tool FREMONT, Calif., April 21, 2022 ...
Seeking Alpha

ACM Research Receives Orders for Wafer-Level Packaging Tools from U.S. Customer and R&D Center

FREMONT, Calif., Sept. 04, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACMR) (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level ...
Yahoo Finance

ACM Research Delivers Multiple Single-Wafer Cleaning Systems to Foundry Customer in Singapore

FREMONT, Calif., Feb. 26, 2026 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer and panel processing solutions for semiconductor and advanced packaging ...
EDN

Wafer-level packaging enters spotlight

SAN JOSE, Calif. — Wafer-level packaging (WLP)–the fabrication of the IC package directly on the wafer–is finally moving into the spotlight after years' of promises, according to an expert in the ...
Semiconductor Engineering

A Novel Multifunctional Single-Layer Adhesive Used For Both Temporary Bonding And Mechanical Debonding in Wafer-Level Packaging Applications

Temporary bonding (TB) and debonding (DB) of wafers have been widely developed and applied over the last decade in various wafer-level packaging technologies, such as package-on-package (PoP), fan-out ...
EDN

LSI Logic offers wafer-level packaging for ASICs, SoCs

SAN JOSE, Calif. &#151 LSI Logic Corp. announced the availability of its “enhanced” wafer-level packaging technology for ASIC and systems-on-a-chip designs. The technology from LSI Logic (Milpitas, ...
TechAnnouncer

Mastering IC Packaging Design: From Fundamentals to Advanced Techniques

Chiplets are like smaller, specialized chips that can be combined to create a bigger, more powerful system. Heterogeneous integration is the fancy term for putting these different chiplets together in ...