In 1999, Stig Oresjo, then of Agilent Technologies, conducted a major study of solder-joint defects on printed-circuit boards (PCBs). The study, which at the time provided the most definitive data on ...

Catching all defects in chip packaging is becoming more difficult, requiring a mix of electrical tests, metrology screening, and various types of inspection. And the more critical the application for ...

New joining and inspection technologies continue to improve manufacturing quality, process control and production efficiency.

Conversely,experienced embedded designers know to mask or tent BGA vias at thedesign and layout level. Even when this step is omitted, adesign-for-manufacture (DFM) check mapped out at the planning ...

High-bandwidth memory stands at the forefront of multiple technology developments as a critical enabler of AI, but it is one of the most difficult modules to manufacture. Leading HBM device makers and ...

Cold solder joints occur when the temperature during the soldering process is not high enough, and they are difficult to see with the naked eye. “It turned out to be important that we had agreed in ...