New Software Development Kit Brings High-Performance Thermal Simulation And GPU-Accelerated Speed To Integrated Engineering Workflows. MONTREAL, March 11, 2026 /PRNewswire/ - Maya HTT today announced ...

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

The spread of artificial intelligence is forcing an uncomfortable truth on semiconductor manufacturing. Thin films, which are essential for isolating signals and insulating different components and ...

Analog fabs are bolstering their electronic design automation (EDA) tool repository to complement design flows in advanced RF devices, and the latest example comes from Tower Semiconductor’s adoption ...

Manufacturers, retailers, and industry partners are invited to visit Alexium at ISPA Expo 2026 at Booth #2026 to experience the Predictive Thermal Profile and Build Your Own Bed™ activation firsthand.

How in-house-developed and third-party general-purpose simulation tools are limited to a few expert users and aren’t easily shareable. How multiphysics simulation of subsystems can result in an ...

Rising operating costs and increased competition have focused attention on the need to improve thermal performance in nuclear power plants (NPPs), to ensure efficient electricity generation. Efforts ...