Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

The spread of artificial intelligence is forcing an uncomfortable truth on semiconductor manufacturing. Thin films, which are essential for isolating signals and insulating different components and ...

How in-house-developed and third-party general-purpose simulation tools are limited to a few expert users and aren’t easily shareable. How multiphysics simulation of subsystems can result in an ...

Paul Compston, CEO and director; Silvano Sommacal, technical lead, Advanced Diagnostics Division; and John Holmes, senior engineer, New Frontier Technologies Shown here is the laser tape placement ...