At the recent 2026 IEEE Electronic Components and Technology Conference (ECTC), imec and EV Group presented a robust and ...
Through their continued collaboration, Imec and EV Group (EVG) are focusing on advancing the overlay performance required for advanced logic-to-logic and memory-to-logic tier stacking. Imec and EV ...
The ECTC 2026 paper reports breakthrough in the 3D integration for high-performance computing, advanced smart vision, and ...
Wafer bonding underpins the integration of diverse semiconductor materials into unified platforms, enabling three-dimensional stacking and heterogeneous assembly of components with disparate lattice ...
Hybrid bonding has been in production for several years, with mature flows capable of delivering robust yields using 10µm interconnects. At that scale, processes can tolerate hundreds of nanometers of ...
A recent technical paper titled “Factors determining bond wave speed in wafer bonding” was published by researcher at Yokohama National University, Tokyo Electron Kyushu Limited and ANVOS Analytics.
Samsung is continuing its aggressive push toward next-generation NAND Flash scaling with the development of a new 900-layer V-NAND design built using advanced wafer bonding technology.
Morning Overview on MSN
Researchers just crammed more computing into the same chip space by stacking silicon circuits in multiple layers — a vertical stack that squeezes whole generations …
For decades, chipmakers squeezed more transistors onto processors by shrinking them sideways. That playbook is running out of ...
Resonac is looking for development partners to establish a new debonding process, as well as to market the new temporary bonding film. In the front-end and back-end processes of advanced ...
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