AUSTIN, Texas — LSI Logic Corp. has developed a form of wire bond packaging that places the bonding pads directly on top of the active I/O circuitry on the silicon. The move could extend the reach and ...

Taiwan's top OSAT company ASE Technology Holding has been stepping up its purchases of more automated wire-bonding packaging machines to expand capacity for clients, while also enhancing its smart ...

New generations of small medical electronics devices demand the highest levels of quality and reliability For EMS providers and contract manufacturers, the International Standards Organization (ISO) ...