Most 3D design software requires visual dragging and rotating—posing a challenge for blind and low-vision users. As a result, a range of hardware design, robotics, coding, and engineering work is ...

Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.

The pace of innovation in advanced packaging is rewriting the rules that IC and package teams have relied on for decades.

The use of Artificial Intelligence (AI) into 3D product design is increasingly impactful, especially during the initial stages of image creation, brainstorming and conceptualization. A variety of AI ...

When Amber Jae Slooten, the now-creative director of digital fashion house The Fabricant, was studying at the Amsterdam Fashion Institute (Amfi) in 2013, she wanted to create digital-only clothes but ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

Yiqi is a thought leader in Digital Journal’s Insight Forum (become a member). In the rapidly evolving landscape of design, the integration of 3D technology is no longer a niche reserved for animation ...