At the rack level, AI training clusters are now so dense that the thermal ceiling, not compute power, is what limits ...

The chips that datacenters use to run the latest AI breakthroughs generate much more heat than previous generations of silicon. Anybody whose phone or laptop has overheated knows that electronics ...

Forward-looking: Microsoft has taken a significant step toward addressing the thermal challenges of next-generation data processing hardware. The company has developed an in-chip microfluidic cooling ...

Data center rack density has risen rapidly in recent years. Operators are cramming more computing power into each server rack to meet the needs of AI and other high-performance computing applications.

Researchers led by Assoc. Prof. Dr. Savaş Taşoğlu from the Department of Mechanical Engineering at Koç University have developed a new, open-access and machine learning-assisted design tool aimed at ...

Microfluidics involves fluid manipulation and control at a submillimeter scale within microfabricated channels etched on a chip, forming a miniature laboratory capable of performing complex analytical ...