*Note: The 4.7 mmD implant features a green color-coded 3.5 mmD platform and the 6.0 mmD implant has a purple color-coded 4.5 mmD platform, unlike TSV® Implants.

Feb 24, 2025 · Could someone post a link to the document " Multi-Core Implementation in RTD of S32K3"? My application is using the S32 DS to create applications for the S32K388 processor.

In this paper, we present a programming methodology for converting applications to run on multicore devices. We also describe the features of Texas Instruments DSPs that enable …

Feb 24, 2025 · Where I can find some info about the management inside Aurix of shared resourced between cores? Let's assume I've a 3 core derivative (TC37) and all the core at the …

Muntjac is a minimal 64-bit RISC-V multicore processor that's easy to understand, verify, and extend. The focus is on having a clean, well-tested design which others can build upon and …

Dec 3, 2021 · The benefits of using 2.5D and 3D TSV technology is the improved power management, increased data transfer rates, better signal integrity, and the increase in bandwidth.

The primary focus of the paper is TSV based 3D ICs, although we also discuss recent advances in monolithic 3D ICs. The objective of this paper is to provide a unified perspective on the …

In this paper, we propose a new TSV sharing method for a circuit-switched 3-D mesh-of-tree (MoT) interconnect, which supports high-throughput and low-latency communication between …

also referred as CPU1 and CPU2 respectively. An important aspect in a multi-core application development is t. split the resources across different cores. The F2838x device includes …

Design, simulate and generate code for multicore models of Infineon ® AURIX™ TC3x microcontrollers. Microcontrollers in the Infineon AURIX TC3x family might contain up to six …